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TIM-C150 Series Non-Silicone Gap Filler Pads / TIM-C150 Series


Thermal conductivity of 1.5 W/m.K.
No silicone extractions ( acrylate resin).
Low thermal resistance.
Max size available : 100 x 150 mm.


Between chassis wall and heat sink.
Between CPU and heat sink.
Component to heat spreader.
Between semiconductor and heat sink, etc...




   Registered Company Number: 3832422 - VAT Number: GB740 7652 32
   MEC is a division of Marcom Electronic Components (UK) Ltd.
   Copyright © 2016 Marcom Electronic Components (UK) Limited. - All rights reserved.
   View sitemap.

   Address:   MEC, Marcom House, 1-2 Steam Mill Lane, Great Yarmouth, Norfolk, NR31 0HP, United Kingdom.

Cert: 4823
ISO 9001