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TIM-GL150 Series Form Gap Filler Paste / TIM-GL150 Series

Low Modulus Gap Filler Pads


Thermal conductivity of 1.5 W/m.K.
Highly conformable/thermally conductive, high viscosity type silicone compound.
Easily forms and adheres to moist surfaces, shapes, and sizes of components .
Excellent vibration absorption capabilities.
Will not cause corrosion on any metal surface.


Thermal transfer from heat-generating device to heat spreader or heat sink, etc.




   Registered Company Number: 3832422 - VAT Number: GB740 7652 32
   MEC is a division of Marcom Electronic Components (UK) Ltd.
   Copyright © 2016 Marcom Electronic Components (UK) Limited. - All rights reserved.
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   Address:   MEC, Marcom House, 1-2 Steam Mill Lane, Great Yarmouth, Norfolk, NR31 0HP, United Kingdom.

Cert: 4823
ISO 9001