Home : About Us : Downloads : Terms & Conditions : Privacy

   







   



Navigation Tree: Home / Thermal Management / Electronic Components / Form Gap Filler Paste

     
TIM-GL150 Series Form Gap Filler Paste / TIM-GL150 Series

Low Modulus Gap Filler Pads

Feature:

Thermal conductivity of 1.5 W/m.K.
Highly conformable/thermally conductive, high viscosity type silicone compound.
Easily forms and adheres to moist surfaces, shapes, and sizes of components .
Excellent vibration absorption capabilities.
Will not cause corrosion on any metal surface.

Application:

Thermal transfer from heat-generating device to heat spreader or heat sink, etc.

 

 

     
   

   Registered Company Number: 3832422 - VAT Number: GB740 7652 32
   MEC is a division of Marcom Electronic Components (UK) Ltd.
   Copyright © 2016 Marcom Electronic Components (UK) Limited. - All rights reserved.
   View sitemap.

   Address:   MEC, Marcom House, 1-2 Steam Mill Lane, Great Yarmouth, Norfolk, NR31 0HP, United Kingdom.

ISOQAR
Cert: 4823
ISO 9001

>