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TIM-UM1700 Series High Heat Conductivity Putty / TIM-UM1700 Series

Features:

Thermal conductivity of 17.0 W/m.K.
Putty.
Silicon (gel) compound with Aluminium film (10um thick).
The highest thermal conductivity putty type silicon sheet.
Low thermal resistance.
One surface with aluminium film.
Size available: from 10 x 10 mm to 50 x 50 mm, +/- 1mm.

Application:

Thermal transfer from CPU and other heat generating devices to heat sink, etc...

 

 

     
     
TIM-XE1100 Series High Heat Conductivity Putty / TIM-XE1100 Series

Features:

Thermal conductivity of 11.0 W/m.K.
Putty.
Highly conformable, thermally conductive non-flammable interface material.
Excellent surface consistency for filling small air gaps and uneven mating surfaces.
Make relable contact with various shapes and sizes of components.

Application:

Between chassis wall and heat sink.
Between CPU and heat sink.
Component to heat spreader.
Between semiconductor and heat sink, etc...

 

 

     
     
TIM-XP600 Series High Heat Conductivity Putty / TIM-XP600 Series

Features:

Thermal conductivity of 6.0 W/m.K.
Putty.
Highly conformable, thermally conductive non-flammable interface material.
Excellent surface consistency for filling small air gaps and uneven mating surfaces.
Available in sheet
Make reliable contact with various shapes and sizes of components.

Application:

Between chassis wall and heat sink.
Between CPU and heat sink.
Component to heat spreader.
Between semiconductor and heat sink, etc.

 

 

     
   

   Registered Company Number: 3832422 - VAT Number: GB740 7652 32
   MEC is a division of Marcom Electronic Components (UK) Ltd.
   Copyright © 2016 Marcom Electronic Components (UK) Limited. - All rights reserved.
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   Address:   MEC, Marcom House, 1-2 Steam Mill Lane, Great Yarmouth, Norfolk, NR31 0HP, United Kingdom.

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