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TIM-S130 Series Low Modulus Gap Filler Pad / TIM-S130 Series

Low Modulus Gap Filler Pads

Feature:

Thermal conductivity of 1.3 W/m.K.
No electricity conductive.
Absolute lowest modules with high adhesion.
Easily fills air gaps, uneven surfaces.
Lower thermal resistance due to complete surface contact.
Available in sheet.
Thickness 0.5mm,1.0mm,2.0mm,3.0mm,4.0mm,5.0mm.
Tacky.

Application:

Semiconductors to heat sink.
Chassis walls to other surfaces.
Components to heat spreader.
CD-Rom, DVD-Rom cooling, etc.

 

 

     
     
TIM-S140 Series Low Modulus Gap Filler Pad / TIM-S140 Series

Low Modulus Gap Filler Pads

Feature:

Thermal conductivity of 1.4 W/m.K.
Absolute lowest modulus with high adhesion.
Easily fills air gaps, uneven surfaces.
Lower thermal resistance due to complete surface contact.
Available in sheet.
Tacky.

Application:

Semiconductors to heat sink.
Chassis walls to other surfaces.
Components to heat spreader.
CD-Rom, DVD-Rom cooling, etc.

 

 

     
     
TIM-S150 Series Low Modulus Gap Filler Pad / TIM-S150 Series

Low Modulus Gap Filler Pads

Feature:

Thermal conductivity of 1.5 W/m.K.
Ultra soft type.
Soft and compressible for low stress applications.
Naturally tacky needing no further adhesive coating.
Fiberglass reinforced for puncture, shear & tear resistance.
Available in sheet.
Tacky.

Application:

Plasma supply panels.
RDRAM memory modules.
Heat pipe thermal solutions.
Automotive engine control units.
Wireless communication hardware, etc.

 

 

     
     
TIM-S180 Series Low Modulus Gap Filler Pad / TIM-S180 Series

Low Modulus Gap Filler Pads

Feature:

Thermal conductivity of 1.8 W/m.K.
Low thermal resistance at very low pressures.
Highly conformable, low hardness.
Designed for low-stress applications.
Fiberglass reinforced for puncture, shear & tear resistance.
Available in sheet.
Tacky.

Application:

Computer and peripherals.
RDRAM memory modules.
Telecommunications.
CDROM/DVD cooling.
Between CPU and heat spreader, etc.

 

 

     
     
TIM-S290 Series Low Modulus Gap Filler Pad / TIM-S290 Series

Low Modulus Gap Filler Pads

Feature:

Thermal conductivity of 2.9 W/m.K.
Absolute lowest modules with high adhesion.
Easily fills air gaps, uneven surfaces.
Lower thermal resistance due to complete surface contact.
Tacky.

Application:

Semiconductors to heat sink.
Chassis walls to other surfaces.
Components to heat spreader.
CD-Rom, DVD-Rom cooling, etc.

 

 

     
   

   Registered Company Number: 3832422 - VAT Number: GB740 7652 32
   MEC is a division of Marcom Electronic Components (UK) Ltd.
   Copyright © 2016 Marcom Electronic Components (UK) Limited. - All rights reserved.
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   Address:   MEC, Marcom House, 1-2 Steam Mill Lane, Great Yarmouth, Norfolk, NR31 0HP, United Kingdom.

ISOQAR
Cert: 4823
ISO 9001

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