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SMD Grounding Clip / OGCP Series

The PCB on-board grounding clip enables easy removal of the shielding can. Multi-point contact grounding is provided to the shielding can and also reinforces shielding performance. The on-board grounding clip also provides better workability.

Special Features:
OGCP-1182435: Separate structure of clip and support portion is resistant to side slide loading.
OGCP-502423: The wide opening provides easy insertion of a shielding can.
OGCP-702020: Locking structure provides "click feel" on instillation. 

Material:

OGCP-1182435/OGCP-650813R: Phosphor bronze for spring(Sn reflow plating/Primary plating:Cu)
OGCP-650813G: Titanium Copper alloy(One side Au plating/The under plating by Ni)
OGCP-65083G: Titanium copper alloy (one side Au plating/The under plating by Ni)
OGCP-502423/OGCP-702020: Phosphor bronze for spring (Sn reflow plating)
OGCP-702020G: Phosphor bronze for spring (gold plating)



ANNOTATION

All specifications shown herein are typical values and are not guaranteed.  It is recommended to test in application for suitability.

 

   

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ISOQAR
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ISO 9001

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